3 Specialized Etch Processes for Photonics Fabrication

There are typical etch processes that are used in nearly every process flow, but there are also specialized etch processes that are specific to unique aspects of the application. Photonics manufacturing is no exception. Whether fabricating image sensors or photonic circuits, dry etch processes will be key to creating features with excellent optical properties....

How to Minimize Downtime for Etch and Deposition Equipment

Semiconductor plasma etch and deposition equipment has drastically different usage profiles when used in industry as compared to its use in research and academia. While the physics governs both applications, their end uses are different, and thus require different considerations for optimization....

Bringing Micro-lenses Into Focus

  It is not surprising that the scaling techniques used to enable Moore’s Law over the last several decades are being applied to similarly scale down the structures using macro-optics. As feature sizes of transistors have shrunk so that millions to billions of transistors fit on a chip, optical components have also been reduced in size. Many of these efforts are leading the way for advances in photonics. For example, chip-to-chip connections with relatively large fiber optics have evolved such that micron-sized chip-scale waveguides for making photonic based interconnects are now a possibility. Similarly, micro-lenses are opening up new applications that were once the domain of macro-lenses. This article introduces micro-lenses and how they are made using semiconductor processing techniques....

Etching of Difficult Metals

Over time three primary approaches have been developed to pattern metals: Wet etching, a physical deposition approach known as “lift-off,” and plasma etching. Wet etching, while having relatively low associated equipment costs, are limited by the isotropic nature of the etch mechanism. In this subtractive method, the isotopic etching behavior is only useful for features with non-critical dimensions (e.g. >~5 μm). There is no doubt that wet etching has applicability to larger features where the amount of undercut is small in relation to the feature size. Although wet etching processes are typically highly selective, the extremely reactive reagents often needed to etch metal may damage other exposed materials....

To Bosch or Not to Bosch: Deep Reactive Ion Etching of Silicon

The ability to pattern silicon has been the foundation of modern electronics. Depending on the specific application there are multiple methods to consider. Here we will focus on dry etching and constrain the discussion to well-known methods that can deliver anisotropic (as opposed to isotropic) features....

CORIAL's Top Blog Posts of 2020

For more than 30 years we have been providing those in industry and academia with capital equipment that designs and manufactures plasma etch and deposition systems. The goal of our blog is to provide powerful resources and information for our clients and visitors. We have pulled a list of our most popular blogs of 2020 and hope they bring you new insight into the world of plasma etching. ...