Plasma technologies
Push the limits of material processing with CORIAL’s plasma-based technologies that enable the manufacture of next generation devices for specialty semiconductor markets.
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RIE
Simple-to-operate equipment for etching a wide range of materials with moderate etch rates.
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ICP-RIE
Available processes span from low damage etching to rapid etching of hard materials.
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DRIE
High etch rate, excellent profile control, and high selectivity for etch depth greater than 100 µm.
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ICP-CVD
Technology for film deposition on-to temperature and/or damage-sensitive substrates.
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PECVD
Uniform deposition of thin films (Si, SiO2, Si3N4, etc.), with excellent control of material properties.
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ALE
Etch technology enabling the controlled removal of material from a substrate, layer-by-layer.