Plasma technologies

Push the limits of material processing with CORIAL’s plasma-based technologies that enable the manufacture of next generation devices for specialty semiconductor markets.

RIE-GaP-Anisotrope-PWP-ST

RIE

Simple-to-operate equipment for etching a wide range of materials with moderate etch rates.

ICP-RIE technology

ICP-RIE

Available processes span from low damage etching to rapid etching of hard materials.

ICP-RIE-DSE-Bosch-60µm-PWP-ST

DRIE

High etch rate, excellent profile control, and high selectivity for etch depth greater than 100 µm.


ICP-CVD-SiO2-Step-coverage-PWP-ST

ICP-CVD

Technology for film deposition on-to temperature and/or damage-sensitive substrates.

PECVD-D500-Si3N4-Step-PWP-ST

PECVD

Uniform deposition of thin films (Si, SiO2, Si3N4, etc.), with excellent control of material properties.


ALE-technology

ALE

Etch technology enabling the controlled removal of material from a substrate, layer-by-layer.

ALD-technology

ALD

Highly conformal coatings for MEMS applications, and semiconductor devices.