Plasma technologies
Push the limits of material processing with CORIAL’s plasma-based technologies that enable the manufacture of next generation devices for specialty semiconductor markets.
![RIE-GaP-Anisotrope-PWP-ST RIE-GaP-Anisotrope-PWP-ST](https://corial.plasmatherm.com/hubfs/RIE-GaP-Anisotrope-PWP-ST.jpg)
RIE
Simple-to-operate equipment for etching a wide range of materials with moderate etch rates.
![ICP-RIE technology ICP-RIE technology](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/ICP-RIE-SiC-Via-hole-PWP-ST-1.jpg)
ICP-RIE
Available processes span from low damage etching to rapid etching of hard materials.
![ICP-RIE-DSE-Bosch-60µm-PWP-ST ICP-RIE-DSE-Bosch-60µm-PWP-ST](https://corial.plasmatherm.com/hubfs/ICP-RIE-DSE-Bosch-60%C2%B5m-PWP-ST.jpg)
DRIE
High etch rate, excellent profile control, and high selectivity for etch depth greater than 100 µm.
![ICP-CVD-SiO2-Step-coverage-PWP-ST ICP-CVD-SiO2-Step-coverage-PWP-ST](https://corial.plasmatherm.com/hubfs/ICP-CVD-SiO2-Step-coverage-PWP-ST.jpg)
ICP-CVD
Technology for film deposition on-to temperature and/or damage-sensitive substrates.
![PECVD-D500-Si3N4-Step-PWP-ST PECVD-D500-Si3N4-Step-PWP-ST](https://corial.plasmatherm.com/hubfs/PECVD-D500-Si3N4-Step-PWP-ST.jpg)
PECVD
Uniform deposition of thin films (Si, SiO2, Si3N4, etc.), with excellent control of material properties.
![ALE-technology ALE-technology](https://corial.plasmatherm.com/hubfs/ALE-technology.jpg)
ALE
Etch technology enabling the controlled removal of material from a substrate, layer-by-layer.