Plasma technologies for processing a wide range of materials required for Micro Electro Mechanical Systems fabrication

MEMS market overview

Micro Electromechanical Systems (MEMS) are miniaturized devices combining electrical and mechanical elements, and are made using microfabrication techniques. MEMS devices are capable of sensing and interacting with their surrounding environment.

These sensing technologies are changing our world with multiple devices being used in consumer and industrial products, such as gyroscopes for smartphones, accelerometers in automobiles, wireless communication systems, and microfluidic chips for health care. The era of the Internet of Things (IOT) will further increase the impact of MEMS in our everyday life, enabling smart devices to interact with our world.

CORIAL solutions

CORIAL etch and deposition technologies are designed to handle the wide range of materials required for MEMS devices fabrication, including dielectrics, metals, silicon, and magnetic materials.

Besides deep silicon etching, CORIAL also innovates by developing processes and systems to serve the latest customer needs, such as deep etching of hard materials like glass or sapphire, thick SiO2 film deposition for hard mask applications, and etching of piezoelectric films.

AdvantagesCORIAL Advantages


Exceptional process flexibility from piezo MEMS to optical MEMS, bio MEMS and NEMS


Equipment easily scalable from R&D to volume production


Cost-effective solutions

processEtch processes

We have broad experience processing a wide range of materials with precise control of the etch profile, fast etch rates, and excellent etch uniformity.

Deep silicon etching using time-multiplexed etch process

  • Etch through the wafer
  • Etch rate > 3 µm/min
  • Selectivity vs. PR mask > 180:1

High aspect ratio glass pillars etch process

  • Etch depth 80 µm
  • Etch rate 0.6 µm/min
  • Selectivity 25:1

Dielectric etch

  • SiO2 layer etch
  • Etch rate 400 nm/min
  • Etch depth 0.8 µm

processDeposition processes

CORIAL’s products offer many options for dielectric deposition, including thin SiO2 and Si3N4 films used as sacrificial layers, and thick films used as etch hardmasks. We deliver processes that ensure tight control of film stress, from tensile to compressive, and fast deposition rates, without any compromise in deposition uniformity, or film quality (low BOE etch rates for SiO2, low KOH and TMAH etch rates for Si3N4).

High-temperature SiO2 layer

  • Deposition rate 250 nm/min
  • BOE etch rate <100 nm/min
  • Stress -190 ± 50 MPa
PECVD process for stress-less SiO2 layer deposition
  • Deposition rate 350 nm/min
  • BOE etch rate <240 nm/min
  • Stress 10 ± 50 MPa

Thick SiO2 film deposition for hard mask

  • 100 µm thick deposited layers
  • Deposition rate 550 nm/min
  • No manual cleaning of reactor


Corial 210IL process

  • ICP-RIE etch system with load-lock for R&D
  • Fast etch rates for silicon, oxides and polymers
  • Bosch process for silicon, and deep etch of hard materials in the same reactor

Corial D250 process

Corial D250
  • PECVD system for R&D and low volume production
  • High system uptime with in-situ plasma cleaning
  • High quality SiO2, Si3N4, SiOCH, SiOF, SiC and aSi-H films deposition

Corial D250L process

  • Same capabilities as Corial D250, plus vacuum load-lock for higher throughput

Corial 300S process

  • Large area RIE etch system for fluorinated chemistries
  • Manual loading for batch sizes up to 7 x 100 mm wafers
  • Retractable liner for metal sputter etch

Corial 360IL process

  • ICP-RIE etch system for 24/7 production environment
  • Load-lock for batch sizes up to 7 x 100mm wafers
  • Fast etch rates for sapphire, oxides and polymers

Corial D350 process

  • PECVD deposition system for 24/7 production environment
  • Manual loading for up to 300 mm wafers
  • High quality SiO2, Si3N4, SiOCH, SiOF, SiC and aSi-H films deposition

Corial D350L process

  • Same capabilities as Corial D350, plus vacuum load-lock for higher throughput

Corial D500process

  • Very large area PECVD deposition system
  • High throughput: 104x2’’ ; 25x4’’ ; 9 x 6’’ or plates up to 500 mm x 500 mm