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Etching tools and deposition tools

Get the best Cost of Ownership with the most versatile, compact and reliable etch and deposition systems of the industry.

CORIAL 200 SERIES – Systems for R&D and Low Volume Production

Corial 200FA RIE etch system - Plan

Corial 200FA

  • Deprocessing of dies and packaged dies
  • Fast and clean etching of SiO2, Si3N4, and Polyimide layers
  • Automated EPD to prevent TiN or metals etch
Corial 200S RIE etch system - Plan

Corial 200S

  • Simply to use, manually loaded RIE system
  • Small wafer pieces up to full 200 mm wafer
  • Si, silicon compounds, metals and polymers etch with fluorinated reactive gases
Corial 200R RIE etch system - Plan

Corial 200R

  • Easy to use system
  • Stepped upgrades available
  • For silicon-based compounds, metals and polymers etch
Corial 210RL RIE etch system - Plan

Corial 210RL

  • Flexible solution for reactive ion etching
  • Compatible with chlorinated chemistries
  • Silicon, silicon compounds, polymers, III-V & II-VI compounds and metals etch
Corial 200I 200 mm ICP-RIE etch system - Plan

Corial 200I

  • For single wafers over up to 200 mm, dies or packaged dies
  • Fluorinated and oxygen based chemistries
  • Silicon compounds and polymers etching
Corial 210IL 200 mm ICP-RIE etch system - Plan

Corial 210IL

  • Small wafer pieces up to full 200 mm wafer
  • Support ICP, RIE, ALE and DRIE process recipes in the same reactor
  • Fast etch rates and excellent uniformities
Corial 210D 200 mm ICP-CVD equipment

Corial 210D

  • ICP-CVD system for R&D
  • Low temperature deposition
  • High quality SiO2, Si3N4, SiOCH, SiOF, SiC and aSi-H films
Corial D250 200 mm PECVD system

Corial D250

  • PECVD system for low volume production
  • In-situ plasma cleaning
  • High quality SiO2, Si3N4, SiOCH, etc… films deposition
Corial-D250L-vue-DIM-DRT-sans-Hab

Corial D250L

  • High throughput (load-lock)
  • In-situ plasma cleaning
  • High quality SSiOF, SiC and aSi-H films, etc…films deposition

CORIAL 300 SERIES – Systems for 24/7 production environment

Corial 300S

Corial 300S

  • Large area reactor chromium etching for photomask fabrication
  • From single wafer up to batch processing of 7 x 100 mm wafers
  • Retractable liner for metal sputter etch
Corial 360RL RIE etch system

Corial 360RL

  • Large area reactor chromium etching for photomask fabrication
  • From single wafer up to batch processing of 7 x 100 mm wafers
  • GaAs, GaP, InP, GaN and AlGaN etch
Corial 360IL 300 mm ICP-RIE etch system - Plan

Corial 360IL

  • System for 24/7 production environment
  • Load-lock for batch up to 7 x 100mm wafers
  • Fast etching rates for sapphire, oxides and polymers etch

 

Corial D350 300 mm PECVD system

Corial D350

  • PECVD deposition system for 24/7 production environment
  • Manual loading for up to 300 mm wafers
  • High quality SiO2, Si3N4, SiOCH, SiOF, SiC and aSi-H films deposition
Corial D350L 300 mm PECVD system with load-lock

Corial D350L

  • PECVD deposition system for 24/7 production environment
  • Load-lock to increase throughput
  • High quality SiO2, Si3N4, SiOCH, SiOF, SiC and aSi-H films deposition

CORIAL 500 SERIES – Very large area batch system

Corial D500 high throughput PECVD system

Corial D500

  • Very large area PECVD deposition system
  • High throughput: 104x2’’ ; 25x4’’ ; 9 x 6’’ or plates up to 500 mm x 500 mm

Software

Process edition

CORTEX®, for continuous wave recipes

  • To develop processes, to operate, and to maintain CORIAL systems
  • Simple to use GUI interface
  • Multiple users access rights
Process Dev

CORTEX® Pulse for time multiplexed recipes

  • To control and pulse any process parameter, with a minimum pulsation period of 10 ms
  • Control of DRIE Bosch, ALE and ALD processes on conventional systems
Bosch datalog_1

GLANCE™ RS, for reprocessing

  • Display up to 4 parameters of a run
  • Zoom on a specific step to fine tune the process
  • Capability to compare 2 runs
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