Mar 9, 2022 |
Plasma Processing Technology,
What is wafer singulation? Wafer singulation is the process of cutting or dicing a finished wafer into individual chips. Integrated circuits are typically built on a thin, round wafer of silicon used as the substrate for wafer processing for semiconductor manufacturing. The slices of silicon can be up to 18 inches and contain hundreds to thousands of individual die. The dicing process, or singulation process, is where a wafer dicing technique is used to cut each die with a diamond blade, laser, or plasma into individual chips that can be later mounted and assembled in advanced packaging....