Bernin, FRANCE (March 19th, 2018)
CORIAL, the plasma processing equipment manufacturer and plasma process developer for specialty semiconductor markets, announced today that Institute of Microelectronics of Barcelona (IMB-CNM-CSIC) has ordered a 300 mm PECVD system (Corial D350L) for the research and development of advanced Micro/Nano integrated systems. This order strengthens CORIAL’s position in Europe.
Headquartered in Barcelona, IMB-CNM-CSIC is a leading European Research Center since its foundation in 1985. The research activities of IMB-CNM-CSIC are dedicated to Micro/Nano Integrated Systems: miniaturized electronic systems which include sensing and/or actuating capabilities in addition to electronic information processing, power management and external interfaces.
“Corial D350L PECVD tool is uniquely positioned to provide a wide process window,” said Elsa Bernard-Moulin, Marketing Manager of CORIAL. “The addition of a flexible liquid source delivery module with capacity for up to 3 precursors results in achieving new levels of process flexibility towards 2 key applications:
- Deposition of silicon oxide doped with B or P for the formation of BPSG (borophosphosilicate glass) layers useful as dielectric interlevel layers with smoothing topography capabilities,
- Highly conformal deposition of oxide films.”
The Corial D350L is a production-ready PECVD system built on a 300 mm platform, with single wafer and multi-wafer batch capability. The PECVD system is based on CORIAL’s proprietary technology featuring isothermal, pressurized reactor, which provides rapid and uniform thin film deposition on wafers up to 300 mm in diameter.
Typical process performances for thick SiO2 film deposition on 100 mm Si wafer are:
- Thickness up to 5 µm without intermediate plasma cleaning
- High deposition rate up to 300 nm/min
- Uniform WIW thickness (3%) and RI (0.005)
Based on a high temperature, dual pumped configuration, the Corial D350L PECVD system also offers efficient plasma cleaning at operating temperature, with no corrosion of mechanical parts. The system can operate for years without the need for manual cleaning.
About IMB-CNM-CSIC
The Barcelona Microelectronics Institute (IMB) is the Barcelona location of the National Microelectronics Center (CNM). It belongs to the Spanish Research Council (Consejo Superior de Investigaciones Científicas – CSIC) since its foundation in 1985, together with the institutes in Madrid, (IMM-CSIC) and Seville (IMSE-CSIC). The research activities of IMB-CNM-CSIC are dedicated to Micro/Nano Integrated Systems: miniaturized electronic systems which include sensing and/or actuating capabilities in addition to electronic information processing, power management and external interfaces. The staff of IMB-CNM-CSIC is around 175 persons, of which about 90 are researchers Ph.D. students. The Clean Room includes equipment for micro and nanofabrication processes and is especially suitable for R + D + i. The total area is 1500 m2. Class 100-10,000 (ISO 5-7) depending on the areas.
About CORIAL
Built on more than 30 years of combined experience and expertise, CORIAL is the technology leader driving innovation in plasma etch and deposition equipment for specialty semiconductor markets. At CORIAL, we address a range of end-market applications including optoelectronics, failure analysis, MEMS, power devices, advanced packaging, wireless communication and integrated optics. The technologies offered by the company include RIE, ICP, DRIE, ICP-CVD, PECVD, and ALE/ALD. Our R&D team continuously develops and fine-tunes the etching and deposition processes that will enable our customers to structure the materials of today and tomorrow. With unique features such as precise process control for damage free etch, stress free deposition, or in-situ plasma reactor cleaning for the highest industry uptimes, CORIAL is committed to deliver the highest repeatability with the lowest cost of ownership. CORIAL equipment is designed and manufactured in France. Sales and support are provided worldwide through a network of local offices and agents.