Plasma-Therm continues to see strong momentum across its portfolio of advanced technology brands, with growing demand for the Shuttleline platform in research and development environments.
A recent order from a leading U.S.-based research institute includes a Shuttleline platform configured with a PlasmaBox PECVD deposition chamber, supporting advanced thin-film processing requirements.
The Shuttleline platform is designed to provide flexibility across varying substrate sizes, making it well suited for dynamic R&D environments. The PlasmaBox configuration enables high-quality film deposition with strong uniformity, purity, and process control.
This system will support a wide range of research initiatives, including biomedical devices, next-generation semiconductor technologies, advanced power conversion, and quantum computing.
Plasma-Therm continues to support leading institutions with scalable, high-performance solutions that enable innovation across emerging technology areas.
