--- title: Si DRIE process on conventional ICP-RIE tool description: Si DRIE process on conventional ICP-RIE tool | Corial image: https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/Si-DRIE.jpg --- [![CORIAL-PT-LOGO-2021 v6](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL-PT-LOGO-2021%20v6.png?width=3397&height=1147&name=CORIAL-PT-LOGO-2021%20v6.png "CORIAL-PT-LOGO-2021 v6")](https://corial.plasmatherm.com/en) Menu - [ABOUT](https://corial.plasmatherm.com/en/about-corial) - Blank wrapper - [Plasma-Therm Website](http://plasmatherm.com/) - [TECHNOLOGIES](https://corial.plasmatherm.com/en/technologies/plasma-technologies) - blank - blank-inner - Plasma etch - blank-inner - [RIE](https://corial.plasmatherm.com/en/technologies/reactive-ion-etching-rie) - [ICP-RIE](https://corial.plasmatherm.com/en/technologies/icp-rie-inductively-coupled-plasma-reactive-ion-etching) - [DRIE](https://corial.plasmatherm.com/en/technologies/drie-deep-reactive-ion-etching) - blank - blank-inner - blank-inner - [ICP-CVD](https://corial.plasmatherm.com/en/technologies/icp-cvd-inductively-coupled-plasma-chemical-vapor-deposition/) - [PECVD](https://corial.plasmatherm.com/en/technologies/pecvd-plasma-enhanced-chemical-vapor-deposition) - blank - blank-inner - blank-inner - [ALE](https://corial.plasmatherm.com/en/technologies/ale-atomic-layer-etching) - [ALD](https://corial.plasmatherm.com/en/technologies/ald-atomic-layer-deposition) - [BLOGS](https://corial.plasmatherm.com/en/blog) - Blank wrapper - [CORIAL Blog](https://corial.plasmatherm.com/en/blog) - [Plasma-Therm Blog](https://blog.plasmatherm.com) - [CONTACT US](https://corial.plasmatherm.com/en/contact-us) - Blank wrapper # Si DRIE process on conventional ICP-RIE tool Feb 5, 2018 | [Featured Solutions](https://corial.plasmatherm.com/en/blog/tag/featured-solutions) Our Process Team has recently developed a process recipe for deep etch of silicon-based MEMS structures on SoI wafers. [![Si DRIE process on conventional ICP-RIE tool ](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/Si-DRIE.png "Si DRIE process on conventional ICP-RIE tool ")](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/Si-DRIE.png) ## Process recipe This new recipe confirms the capability of our Corial 210IL ICP-RIE etch tool to achieve deep Si etching and at the same time to address all the usual applications of Corial ICP-RIE machines after quick (30 mins) conversion. **CORIAL Bosch-like process has 3 steps** - step 1 – polymer deposition by C4F8 plasma - step 2 – polymer etching  by SF6 plasma - step 3 – Silicon etching with 20W of RF power, which was used to increase the silicon etching rate. To alternate between each step, [COSMA pulse software](https://corial.plasmatherm.com/en/products/cosma-pulse-control-software-for-time-multiplexed-processes/) is required for pulsing consecutively C4F8 gas flow, SF6 gas flow, LF and RF power. ## Corail 210IL ICP-RIE tool with DRIE configuration ![Corail 210IL ICP-RIE tool with DRIE configuration ](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Corial-210IL-300x294.png?width=300&height=294&name=Corial-210IL-300x294.png)   - High power (2 KW) ICP source producing uniform high density plasma, - High power (1 KW) RF source to ensure high silicon etch rates, - ICP source with the hot quartz liner allowing to diminish loss of reactive species, - Very high conductance pumping system for operation at high gas flow rates, - Helium pressure to ensure the thermal transfer between the cathode, the substrate holder and the substrates, - Aluminum brace between ICP source and vacuum vessel to balance the ion and reactive species fluxes in order to enable Bosch-like processes, - COSMA Pulse software enabling time-multiplexed processing, - Capability to process a wide range of materials including silicon, oxides, nitrides, polymers, metals, III-V & II-VI compound semiconductors, and hard materials after quick hardware conversion. ## Process performances for application #1 - 60 µm etch depth demo for a process requiring to stop on an SiO2 layer buried at 60 µm below the substrate surface, - Open Si area is 10%, the rest surface was covered by Kapton.   - **5 µm feature size** - **Etch rate 1.4 µm/min** - **selectivity vs. SiO2 110** - **Profile \> 90°** - **AR 1:17** - **Uniformity over 4’’ wafer is 4% with exclusion zone of 10 mm** ## Process performances for application #2 - 200 µm etch depth demo for a TSV process, - Open Si area is 10%, the rest surface was covered by Kapton.   - **5 µm feature size** - **Etch rate 0.91 µm/min** - **AR 1:33** - **Selectivity vs. SiO2 \>70** - **Profile Anisotropic** - **Uniformity over 4’’ wafer is 4% with exclusion zone of 10 mm** - - - [mailto:?subject=https://corial.plasmatherm.com/en/blog/featured-solutions/drie-process-on-conventional-icp-rie-tool](mailto:?subject=https://corial.plasmatherm.com/en/blog/featured-solutions/drie-process-on-conventional-icp-rie-tool) ### Subscribe Here ### Recent Posts ### Post Tags - [Plasma Processing Technology (28)](https://corial.plasmatherm.com/en/blog/tag/plasma-processing-technology) - [Company News (16)](https://corial.plasmatherm.com/en/blog/tag/company-news) - [Etching Tools (14)](https://corial.plasmatherm.com/en/blog/tag/etching-tools) - [Featured Solutions (14)](https://corial.plasmatherm.com/en/blog/tag/featured-solutions) - [Deposition Tools (10)](https://corial.plasmatherm.com/en/blog/tag/deposition-tools) - [CORIAL products (3)](https://corial.plasmatherm.com/en/blog/tag/corial-products) - [Employee Spotlight (3)](https://corial.plasmatherm.com/en/blog/tag/employee-spotlight) - [Research and Development (3)](https://corial.plasmatherm.com/en/blog/tag/research-and-development) - [Events (2)](https://corial.plasmatherm.com/en/blog/tag/events) - [Customer Spotlight (1)](https://corial.plasmatherm.com/en/blog/tag/customer-spotlight) - [Wafer Singulation (1)](https://corial.plasmatherm.com/en/blog/tag/wafer-singulation) see all [![quote\>newsletter](https://no-cache.hubspot.com/cta/default/7547247/2be88541-9961-4fe9-b07c-314e5e653888.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/2be88541-9961-4fe9-b07c-314e5e653888) [![quote](https://no-cache.hubspot.com/cta/default/7547247/0ee740a6-9189-46b7-b114-011ce7f398c6.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/0ee740a6-9189-46b7-b114-011ce7f398c6) [![contact](https://no-cache.hubspot.com/cta/default/7547247/d30e55cc-6021-44b7-a53e-75407de513de.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/d30e55cc-6021-44b7-a53e-75407de513de) ![Corial](https://corial.plasmatherm.com/hubfs/raw_assets/public/CORIAL_May_2020/images/logo-white-1.png) - [ABOUT](https://corial.plasmatherm.com/en/about-corial) - [TECHNOLOGIES](https://corial.plasmatherm.com/en/technologies/plasma-technologies) - [BLOGS](https://corial.plasmatherm.com/en/blog) - [CONTACT US](https://corial.plasmatherm.com/en/contact-us) #### Follow us on - [LinkedIn](https://fr.linkedin.com/company/corial) - [Twitter](https://twitter.com/corial_company) - [Facebook](https://www.facebook.com/CORIALaplasmathermcompany) Copyright CORIAL 2023 – All rights reserved | [Legal information](https://corial.plasmatherm.com/en/about-corial/en/legal-information/) | [Credits](https://corial.plasmatherm.com/en/about-corial/en/credits/) - [![contact](https://no-cache.hubspot.com/cta/default/7547247/07a71f9a-0aeb-4a95-86c9-4a2dfd7285c2.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/07a71f9a-0aeb-4a95-86c9-4a2dfd7285c2)