Microelectromechanical Systems (MEMS)

Plasma technologies for processing a wide range of materials required for Micro Electro Mechanical Systems fabrication

MEMS MARKET OVERVIEW
CORIAL SOLUTIONS & ADVANTAGES
ETCH PROCESSES
DEPOSITION PROCESSES
PRODUCTS

MEMS market overview

Micro Electromechanical Systems (MEMS) are miniaturized devices combining electrical and mechanical elements, and are made using microfabrication techniques. MEMS devices are capable of sensing and interacting with their surrounding environment.

These sensing technologies are changing our world with multiple devices being used in consumer and industrial products, such as gyroscopes for smartphones, accelerometers in automobiles, wireless communication systems, and microfluidic chips for health care. The era of the Internet of Things (IOT) will further increase the impact of MEMS in our everyday life, enabling smart devices to interact with our world.

CORIAL solutions

CORIAL etch and deposition technologies are designed to handle the wide range of materials required for MEMS devices fabrication, including dielectrics, metals, silicon, and magnetic materials.

Besides deep silicon etching, CORIAL also innovates by developing processes and systems to serve the latest customer needs, such as deep etching of hard materials like glass or sapphire, thick SiO2 film deposition for hard mask applications, and etching of piezoelectric films.

CORIAL Advantages

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Exceptional process flexibility from piezo MEMS to optical MEMS, bio MEMS and NEMS

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Equipment easily scalable from R&D to volume production

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Cost-effective solutions

Etch processes

We have broad experience processing a wide range of materials with precise control of the etch profile, fast etch rates, and excellent etch uniformity.

Deep silicon etching using time-multiplexed etch process

Etch through the wafer
Etch rate > 3 µm/min
Selectivity vs. PR mask > 180:1

High aspect ratio glass pillars etch process

Etch depth 80 µm
Etch rate 0.6 µm/min
Selectivity 25:1

Dielectric etch

SiO2 layer etch
Etch rate 400 nm/min
Etch depth 0.8 µm

Deposition processes

CORIAL’s products offer many options for dielectric deposition, including thin SiO2 and Si3N4 films used as sacrificial layers, and thick films used as etch hardmasks. We deliver processes that ensure tight control of film stress, from tensile to compressive, and fast deposition rates, without any compromise in deposition uniformity, or film quality (low BOE etch rates for SiO2, low KOH and TMAH etch rates for Si3N4).