--- title: Corial 200I ICP-RIE etch system | Corial description: ICP-RIE equipment for R&D centers and IC failure analysis labs. Benefit from leading edge etch rates for single wafers over up to 200 mm, dies or packaged dies --- [![CORIAL-PT-LOGO-2021 v6](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL-PT-LOGO-2021%20v6.png?width=3397&height=1147&name=CORIAL-PT-LOGO-2021%20v6.png "CORIAL-PT-LOGO-2021 v6")](https://corial.plasmatherm.com/en?hsLang=en) Menu - [ABOUT](https://corial.plasmatherm.com/en/about-corial) - Blank wrapper - [History](https://corial.plasmatherm.com/en/our-story) - [Partnerships & Awards](https://corial.plasmatherm.com/en/about-corial/partnership) - [Careers](https://corial.plasmatherm.com/en/careers) - [A Plasma-Therm Company](https://corial.plasmatherm.com/en/a-plasma-therm-company) - [Plasma-Therm Website](http://plasmatherm.com/) - [RESOURCES](https://corial.plasmatherm.com/resources) - [MARKETS](https://corial.plasmatherm.com/en/markets/specialty-semiconductor) - Blank wrapper - [Microelectromechanical Systems (MEMS)](https://corial.plasmatherm.com/en/markets/microelectromechanical-systems-mems) - [Failure Analysis](https://corial.plasmatherm.com/en/markets/failure-analysis-semiconductor) - [Optoelectronics](https://corial.plasmatherm.com/en/markets/optoelectronics) - Blank wrapper - [Compound Semiconductor Power Devices](https://corial.plasmatherm.com/en/markets/compound-semiconductor-power-devices) - [Advanced Packaging](https://corial.plasmatherm.com/en/markets/advanced-packaging) - [Wireless Communication](https://corial.plasmatherm.com/en/markets/wireless-communication) - Blank wrapper - [Photomask](https://corial.plasmatherm.com/en/markets/photomask-mask-repair) - [Integrated Optics](https://corial.plasmatherm.com/en/markets/integrated-optics) - [R&D](https://corial.plasmatherm.com/en/markets/research-development) - [TECHNOLOGIES](https://corial.plasmatherm.com/en/technologies/plasma-technologies) - blank - blank-inner - Plasma etch - blank-inner - [Plasma etch](https://corial.plasmatherm.com/en/technologies/plasma-etching-process) - [RIE](https://corial.plasmatherm.com/en/technologies/reactive-ion-etching-rie) - [ICP-RIE](https://corial.plasmatherm.com/en/technologies/icp-rie-inductively-coupled-plasma-reactive-ion-etching) - [DRIE](https://corial.plasmatherm.com/en/technologies/drie-deep-reactive-ion-etching) - blank - blank-inner - [Plasma enhanced deposition](https://corial.plasmatherm.com/en/technologies/plasma-deposition) - blank-inner - [Plasma enhanced deposition](https://corial.plasmatherm.com/en/technologies/plasma-deposition) - [ICP-CVD](https://corial.plasmatherm.com/en/technologies/icp-cvd-inductively-coupled-plasma-chemical-vapor-deposition/) - [PECVD](https://corial.plasmatherm.com/en/technologies/pecvd-plasma-enhanced-chemical-vapor-deposition) - blank - blank-inner - [Atomic layer processing](https://corial.plasmatherm.com/en/technologies/atomic-layer-processing-alp) - blank-inner - [Atomic layer processing](https://corial.plasmatherm.com/en/technologies/atomic-layer-processing-alp) - [ALE](https://corial.plasmatherm.com/en/technologies/ale-atomic-layer-etching) - [ALD](https://corial.plasmatherm.com/en/technologies/ald-atomic-layer-deposition) - [PRODUCTS](https://corial.plasmatherm.com/en/products/etching-tools-and-deposition-tools) - blank - hardware - blank-inner - first-wrapper - left - [Shuttleline® 200](https://corial.plasmatherm.com/en/products/shuttline-200) - [Shuttleline® 300](https://corial.plasmatherm.com/en/products/corial-300-series-etching-deposition-tools-for-production-environment-0) - [Shuttleline® 500](https://corial.plasmatherm.com/en/products/corial-500) - mid - [Takachi](https://corial.plasmatherm.com/products-takachi) - [Kayen](https://corial.plasmatherm.com/products-kayen) - [Vision](https://corial.plasmatherm.com/products-vision) - right - blank - Software - blank - first - CORTEX® - links-wrapper - [CORTEX®](https://corial.plasmatherm.com/en/products/cortex-process-control-software) - Process control software - second - CORTEX® - links-wrapper - [CORTEX® Pulse](https://corial.plasmatherm.com/en/products/cosma-pulse-control-software-for-time-multiplexed-processes-0) - Control software for time multiplexed processes - third - GLANCE™ - links-wrapper - [GLANCE™](https://corial.plasmatherm.com/en/products/cosma-rs-reprocessing-software) - Reprocessing Software - [SERVICES](https://corial.plasmatherm.com/en/services) - [BLOGS](https://corial.plasmatherm.com/en/blog) - Blank wrapper - [CORIAL Blog](https://corial.plasmatherm.com/en/blog) - [Plasma-Therm Blog](https://blog.plasmatherm.com) - [CONTACT US](https://corial.plasmatherm.com/en/contact-us) - Blank wrapper - [International Network](https://corial.plasmatherm.com/en/international-network) # Corial 200I ICP-RIE etch system Industry-leading uniformity for etching silicon-based compounds and polymers [THE PRODUCT IN BRIEF](https://corial.plasmatherm.com/en/products/corial-200i-icp-rie-etch-tool#description) [KEY BENEFITS](https://corial.plasmatherm.com/en/products/corial-200i-icp-rie-etch-tool#benefits)[RELATED PROCESSES](https://corial.plasmatherm.com/en/products/corial-200i-icp-rie-etch-tool#processes)[UPGRADES](https://corial.plasmatherm.com/en/products/corial-200i-icp-rie-etch-tool#upgrades) ## Corial 200I ICP etch system in brief The Corial 200I ICP-RIE system is designed for R&D centers and IC failure analysis labs. This equipment uses fluorine- and oxygen-based chemistries to provide leading edge etch rates and uniformities for full wafers of up to 200 mm, as well as dies or packaged dies. Featuring a short pump-down cycle (<3 minutes), rapid reactor clean time (<20 minutes), and shuttle loading direct on the carrier, the Corial 200I guarantees high system uptime. ## ![Key Benefits](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Icon-Key-Bebefits.png?width=35&height=35&name=Icon-Key-Bebefits.png)Key benefits R #### FLEXIBILITY Processing of silicon-based compounds and polymers with multiple etching modes The unique shuttle (carrier) design, combined with a standard cathode, enable a cost-effective reactor conversion suitable for multiple applications R #### HIGH PERFORMANCE Exceptional uniformity, and repeatability enabled with a unique high-power ICP reactor with helical antenna Wide pressure range offers capability to precisely tune the etch profile R #### SCALABILITY Low-risk, cost-effective upgrades extend product capabilities and maximize return on investment ## Related processes![Related processes](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Icon-Etch.png?width=35&height=35&name=Icon-Etch.png) Typical materials that can be processed with the Corial 200I ICP-RIE system include: - Silicon and silicon-based compounds (SiO2, Si3N4) - Polymers: PMMA, Polyimide, BCB, Photoresist - Metals: Ti, TiN, TiW, W, Ta, TaN, Ge, Nb, Nbn, Mo The Corial 200I offers differentiated technology and application-focused capabilities for the IC failure analysis and the R&D markets: - Delayering of polymers and silicon-based compounds for sample preparation prior to IC failure analysis - Capability to etch the wide range of materials used in R&D centers ### Deprocessing for 28 nm technology node [![Low-K dielectric etching for 28 nm technology node](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/die-delayering.jpeg "Low-K dielectric etching for 28 nm technology node")](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/die-delayering.jpeg?hsLang=en) ## Low-K dielectric etching for 28 nm technology node **Failure analysis** - Low-K dielectric etching - Etch rate 300 nm/min - Selectivity vs. Al/Cu > 50:1 ### ILD deprocessing on wafer [![SiO2 deprocessing for IC failure analysis in 40 nm technology](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/SiO2-etch-failure-analysis-40nm-technology-1.png "SiO2 deprocessing for IC failure analysis in 40 nm technology")](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/SiO2-etch-failure-analysis-40nm-technology-1.png?hsLang=en) ## SiO2 deprocessing for IC failure analysis in 40 nm technology **Failure analysis** - SiO2 etching - Etch rate 140 nm/min - Selectivity vs. metal > 50:1 ### Silicon Dioxide (SiO2) RIE etch process [![Silicon Dioxide (SiO2) RIE etch process on 150 mm wafer](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/RIE-reactive-ion-etching-process-silicon-dioxide-SiO2-etching.jpg "Silicon Dioxide (SiO2) RIE etch process on 150 mm wafer")](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/RIE-reactive-ion-etching-process-silicon-dioxide-SiO2-etching.jpg?hsLang=en) ## Silicon Dioxide (SiO2) RIE etch process on 150 mm wafer **R&D** - Etch rate 45 nm/min - Etch depth 800 nm - Uniformity ±3% ### Silicon Nitride (Si3N4) ICP etch process [![Silicon Nitride (Si3N4) ICP etch process on 150 mm wafer](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/ICP-inductive-coupling-plasma-etching-process-silicon-nitride-SI3N4-etching.png "Silicon Nitride (Si3N4) ICP etch process on 150 mm wafer")](https://corial.plasmatherm.com/hubfs/CORIAL_May_2020/images/ICP-inductive-coupling-plasma-etching-process-silicon-nitride-SI3N4-etching.png?hsLang=en) ## Silicon Nitride (Si3N4) ICP etch process on 150 mm wafer **R&D** - Etch rate 350 nm/min - Etch depth 500 nm - Uniformity ±3% ## Upgrades![Icon](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Icon-Related-Product.png?width=35&height=35&name=Icon-Related-Product.png) The Corial 200I ICP-RIE etch system can be thoroughly customized with a wide range of features. ##### Additional gas inputs ![Additional gas inputs ](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Gas-box-211x300.png?width=141&height=200&name=Gas-box-211x300.png) Additional gas inputs (up to 8) for more complex process gas combinations ##### Liner for sputter-etch ![](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Liner-RIE.png?width=330&height=200&name=Liner-RIE.png) Ni coated liner to collect sputtered materials in metal RIE sputter-etch mode Quartz liner to collect sputtered materials in metal ICP sputter-etch mode ##### Load-lock ![Load-Lock](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Load-Lock.jpg?width=320&height=200&name=Load-Lock.jpg) The addition of a load lock enhances process capability (allows the safe use of corrosive and toxic gases), and improves system performance (offers higher process repeatability and faster pump-down time) ##### Variety of pumps ![Dry Vacuum Pump and TMP pump with varied pumping rate for increased control over the process chamber pressure](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Pump.png?width=239&height=200&name=Pump.png) Dry Vacuum Pump and TMP pump with varied pumping rate for increased control over the process chamber pressure ##### Variety of RF power supplies ![Higher and lower watt power supplies with automatic matching network](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/RF-power-supply.png?width=486&height=200&name=RF-power-supply.png) Higher and lower output power supplies with automatic matching network ##### Light tower ![Light tower for easy visualization of the plasma processing sequence](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/Light-tower.png?width=38&height=200&name=Light-tower.png) The signal light tower provides an easy-to-view indicator of the system’s processing status ##### Laser interferometry ![End point detection by laser interferometry to enhance etch control through automated measurement of etch rate and etch depth](https://corial.plasmatherm.com/hs-fs/hubfs/CORIAL_May_2020/images/End-point-detection.png?width=186&height=200&name=End-point-detection.png) End point detection by laser interferometry to enhance etch control through automated measurement of etch rate and etch depth [![quote>newsletter](https://no-cache.hubspot.com/cta/default/7547247/2be88541-9961-4fe9-b07c-314e5e653888.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/2be88541-9961-4fe9-b07c-314e5e653888) [![quote](https://no-cache.hubspot.com/cta/default/7547247/0ee740a6-9189-46b7-b114-011ce7f398c6.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/0ee740a6-9189-46b7-b114-011ce7f398c6) [![contact](https://no-cache.hubspot.com/cta/default/7547247/d30e55cc-6021-44b7-a53e-75407de513de.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/d30e55cc-6021-44b7-a53e-75407de513de) ![Corial](https://corial.plasmatherm.com/hubfs/raw_assets/public/CORIAL_May_2020/images/logo-white-1.png) - [ABOUT](https://corial.plasmatherm.com/en/about-corial) - [RESOURCES](https://corial.plasmatherm.com/resources) - [MARKETS](https://corial.plasmatherm.com/en/markets/specialty-semiconductor) - [TECHNOLOGIES](https://corial.plasmatherm.com/en/technologies/plasma-technologies) - [PRODUCTS](https://corial.plasmatherm.com/en/products/etching-tools-and-deposition-tools) - [SERVICES](https://corial.plasmatherm.com/en/services) - [BLOGS](https://corial.plasmatherm.com/en/blog) - [CONTACT US](https://corial.plasmatherm.com/en/contact-us) #### Follow us on - [LinkedIn](https://fr.linkedin.com/company/corial) - [Twitter](https://twitter.com/corial_company) - [Facebook](https://www.facebook.com/CORIALaplasmathermcompany) Copyright CORIAL 2023 – All rights reserved | [Legal information](https://corial.plasmatherm.com/en/about-corial/en/legal-information/?hsLang=en) | [Credits](https://corial.plasmatherm.com/en/about-corial/en/credits/?hsLang=en) - [![contact](https://no-cache.hubspot.com/cta/default/7547247/07a71f9a-0aeb-4a95-86c9-4a2dfd7285c2.png)](https://cta-redirect.hubspot.com/cta/redirect/7547247/07a71f9a-0aeb-4a95-86c9-4a2dfd7285c2) [![real time web analytics](https://c.statcounter.com/12554016/0/c7d47b53/1/)](https://statcounter.com/)