Top-5 semiconductor company acquires CORIAL’s system

We are delighted to announce that a major Fabless company has selected CORIAL to equip its IC Failure Analysis lab in Asia.

Differentiated technology for Failure Analysis

The Corial 200I ICP system offers polymers and silicon-based compounds delayering capabilities making it eminently suitable for semiconductor manufacturing.

The system is built on 200 platform,with dies and multi-wafer batch capabilities.

Delayering of dies and wafers up to 200 mm

Corial 200I features

•  Very uniform reactor (±3%) with hot walls to enable the use of highly polymerising gas for selective etching against TiN, W and polysilicon,
• Unique shuttle design, combined with a standard cathode, which allows a cost effective reactor adaptation in order to fit with any die shape and size or any wafer size,
• Endpoint detector fully integrated in our hardware and software package. It offers the possibility of viewing the sample while etching, real time etch rate and etched depth calculations and automatic process stop.

Proven etch processes

For more than 10 years, CORIAL drives innovation in sample preparation for Failure Analysis of electronic devices.

We have developed a variety of processes to enable individual or multi-layer removal of polymers, silicon compounds, ILD, low and ultra-low-K dielectrics, and metals.

Typical performances for ultra-low-K deprocessing on die

• 20 nm technology node
• Etch rate 200 nm/min
• Selectivity vs. Al/Cu > 50:1

DISCOVER OUR SOLUTIONS FOR DIE DELAYERING